View LM4559FJ-E2_8898499.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 1/25 04.dec.2013 rev.003 tsz22111 ? 14? 001 datashee t operational amplifiers low noise operational amplifier lm4559xxx general description the lm4559xxx are low noise operational amplifiers with high gain and wide bandwidth. they have good performance of input referred noise voltage (5 hznv/ ) and total harmonic distortion (0.0003%). these are suitable for audio applications and active filter. features ? high voltage gain ? high slew rate ? low noise voltage ? low total harmonic distortion ? low power consumption application ? audio application ? consumer equipment ? active filter key specifications ? operating supply voltage: 4v to 18v ? temperature range: -40c to +85c ? voltage gain: 110db (typ) ? unity gain bandwidth: 3.3mhz (typ) ? slew rate: 3.5v/s (typ) ? input referred noise voltage: 5 hznv/ (typ) package w(typ) xd(typ) xh(max) sop-8 5.00mm x 6.20mm x 1.71mm sop-j8 4.90mm x 6.00mm x 1.65mm ssop-b8 3.00mm x 6.40mm x 1.35mm tssop-b8 3.00 mm x 6.40mm x 1.20mm msop8 2.90mm x 4.00mm x 0.90mm tssop-b8j 3.00mm x 4.90mm x 1.10mm simplified schematic figure 1. simplified schematic (1 channel only) product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 2/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx pin configuration lm4559f : sop8 lm4559fj : sop-j8 lm4559fv : ssop-b8 lm4559fvt : tssop-b8 lm4559fvm : msop8 lm4559fvj : tssop-b8j ordering information l m 4 5 5 9 x x x - x x part number lm4559xxx package f : sop8 fj : sop-j8 fv : ssop-b8 fvt : tssop-b8 fvm : msop8 fvj : tssop-b8j packaging and forming specification e2: embossed tape and reel (sop8/sop-j8/ssop-b8/tssop-b8/tssop-b8j) tr: embossed tape and reel (msop8) line-up t opr package operable part number -40c to +85c sop8 reel of 2500 lm4559f-e2 sop-j8 reel of 2500 LM4559FJ-E2 ssop-b8 reel of 2500 lm4559fv-e2 tssop-b8 reel of 3000 lm4559fvt-e2 msop8 reel of 3000 lm4559fvm-tr tssop-b8j reel of 2500 lm4559fvj-e2 pin no. symbol 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc -+ + - ch1 ch2 8 1 2 3 4 5 6 7 out1 -in1 +in1 vee vcc out2 -in2 +in2
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 3/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx absolute maximum ratings (t a =25c) parameter symbol rating unit supply voltage vcc ? vee +36 v power dissipation p d sop8 0.68 (note 1,5) w sop-j8 0.67 (note 2,5) ssop-b8 0.62 (note 3,5) tssop-b8 0.62 (note 3,5) msop8 0.58 (note 4,5) tssop-b8j 0.58 (note 4,5) differential input voltage (note 6) v id +36 v input common-mode voltage range v icm (vee - 0.3) to (vee + 36) v operating supply voltage v opr 4 to 18 v operating temperature t opr -40 to +85 c storage temperature t stg -55 to +150 c maximum junction temperature t jmax +150 c (note 1) when used at temperature above t a =25c, reduce by 5.5mw/c. (note 2) when used at temperature above t a =25c, reduce by 5.4mw/c. (note 3) when used at temperature above t a =25c, reduce by 5.0mw/c. (note 4) when used at temperature above t a =25c, reduce by 4.7mw/c. (note 5) mounted on a fr4 glass epoxy pcb(70mm70mm1.6mm). (note 6) the differential input voltage is the voltage difference between inverting input and non-inverting input. input terminal voltage is set to more than vee. caution: absolute maximum rating of each item i ndicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or usage out of absolute maximum rated temperature environment may cause deterioration of characteristics.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 4/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx electrical characteristics : lm4559xxx (unless otherwise specified vcc=+15v, vee=-15v) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 7) v io 25c - 0.5 1.5 mv out=0v input offset current (note 7) i io 25c - 5 100 na out=0v input bias current (note 7) i b 25c - 40 250 na out=0v supply current (note 8) i cc 25c - 3.3 5.0 ma r l = , all op-amps full range - - 6.5 large signal voltage gain a v 25c 20 300 - v/mv out=10v, r l =2k ? 25c 86 110 - db maximum output voltage v om 25c 12 13 - v r l 2k ? 11 12.5 - r l =600 ? maximum output swing bandwidth b om 25c - 32 - khz out=20v p-p , r l =2k ? input common-mode voltage range v icm 25c 12 13 - v common-mode rejection ratio cmrr 25c 80 100 - db out=0v power supply rejection ratio psrr 25c 82 100 - db out=0v slew rate sr 25c 1.5 3.5 - v/s r l =2k ? , c l =100pf unity gain frequency f t 25c - 3.3 - mhz r l =2k ? gain bandwidth gbw 25c - 4 - mhz r l =2k ? , f=1mhz phase margin 25c - 50 - deg r l =2k ? input referred noise voltage v n 25c - 0.7 - vrms a v = 40db, r s =1k ? f=20hz to 20khz - 5 - hznv/ a v = 40db, v icm =0v f=1khz total harmonic distortion + noise thd+n 25c - 0.0003 - % av= 20db f=1khz, r l =2k ? out= 5vrms channel separation cs 25c - 110 - db a v =40db, f=1khz out=1vrms (note 7) absolute value. (note 8) full range: t a =-40c to +85c
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 5/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx description of electri cal characteristics described here are the terms of electric characteristics used in this datasheet. items and symbols used are also shown. note that item name, symbol and their meaning may differ from those on other manufacturer?s document or general documents. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. app lication of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) supply voltage (vcc/vee) indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruct ion of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied betw een non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings does not assure normal operation of ic. for normal operation, use the ic within the input common-mode voltage range characteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient temperature 25 (normal temperature). as for package product, pd is determi ned by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics item (1) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. (2) input offset current (i io ) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) input common-mode voltage range (v icm ) indicates the input voltage range where ic operates normally. (5) maximum output voltage (v om ) indicates the voltage range that the ic c an output under specified load condition. it is typically divided into high-level output voltage and low-level output voltag e. high-level output voltage indicate s the upper limit of output voltage. low-level output voltage indicates the lower limit. (6) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. av = (output voltage) / (differential input voltage) (7) supply current (i cc ) indicates the current that flows within the ic under specified no-load conditions. (8) output source curren t/ output sink current (i source / i sink ) the maximum current that c an be output from the ic under specific output conditions. the output source current indicates the current flowing out from the ic, and the output sink current indica tes the current flowing into the ic. (9) unity gain frequency (f t ) indicates a frequency where the voltage gain of operational amplifier is 1. (10) gain bandwidth (gbw) indicates to multiply by the frequency and the gai n where the voltage gain decreases 6db/octave. (11) phase margin ( ) indicates the margin of phase from 180 de gree phase lag at unity gain frequency. (12) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset vo ltage when the input common-mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) (13) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volta ge)/(input offset fluctuation) (14) input referred noise voltage (v n ) indicates a noise voltage generated inside the operati onal amplifier reflected back to an ideal voltage source connected in series with the input terminal. (15) total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 6/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx (16) channel separation (cs) indicates the fluctuation in the output vo ltage of the driven channel with reference to the change of output voltage of the channel which is not driven. (17) slew rate (sr) indicates the ratio of the change in output voltage wi th time when a step input signal is applied.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 7/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx typical performance curves lm4559xxx -20 -15 -10 -5 0 5 10 15 20 0 5 10 15 20 supply voltage [v] maximum output voltage [v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 -50 -25 0 25 50 75 100 ambient temperature [c] supply current [ma] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 5 10 15 20 supply voltage [v] supply current [ma] -40c 25c 85c figure 3. supply current vs supply voltage figure 4. supply current vs ambient temperature (vcc/vee=15v) figure 5. maximum output voltage vs supply voltage (r l =2k ) -40c 25c (*)the data above is measurement value of typical sample, it is not guaranteed. -40c 25c 85c 85c 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 2. power dissipation vs ambient temperature (derating curve) 85 lm4559f lm4559fj lm4559fv lm4559fvt lm4559fvm lm4559fvj
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 8/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx typical performance curves (reference data) ? continued lm4559xxx -20 -15 -10 -5 0 5 10 15 20 -50 -25 0 25 50 75 100 ambient temperature [ ] maximum output voltage [v] . -6 -4 -2 0 2 4 6 -50-25 0 255075100 ambient temperature [c] input offset voltage [mv] -6 -4 -2 0 2 4 6 -15 -10 -5 0 5 10 15 input common-mode voltage [v] input offset voltage [mv] figure 8. input offset voltage vs ambient temperature (vcc/vee=15v) figure 9. input offset voltage vs input common-mode voltage (vcc/vee=15v) (*)the data above is measurement value of typical sample, it is not guaranteed. 25c -40c 85c figure 7. maximum output voltage swing vs frequency (vcc/vee=15v, t a =25c, r l =2k ) 10 3 10 4 10 5 10 6 10 7 10 8 figure 6. maximum output voltage vs ambient temperature (vcc/vee=15v, r l =2k ) 0 5 10 15 20 25 30 frequency [hz] maximum output voltage swing [v]
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 9/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx typical performance curves (reference data) ? continued lm4559xxx 100 110 120 130 140 150 160 -50 -25 0 25 50 75 100 ambient temperature [c] common mode rejection ratio [db] . 90 100 110 120 130 140 150 -50 -25 0 25 50 75 100 ambient temperature [ ] large signal voltage gain [db] . 0 1 2 3 4 5 6 -50-25 0 255075100 ambient temperature [c] slew rate l-h [v/s] figure 11. common mode rejection rati o vs ambient temperature (vcc/vee=15v) 80 85 90 95 100 105 110 115 120 -50 -25 0 25 50 75 100 ambient temperature [c] power supply rejection ratio [db] figure 12. power supply rejection ratio vs ambient temperature figure 13. slew rate l-h vs ambient temperature (vcc/vee=15v, r l =2k , c l =100pf) (*)the data above is measurement value of typical sample, it is not guaranteed. figure 10. large signal voltage gain vs ambient temperature (vcc/vee=15v, r l =2k )
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 10/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx typical performance curves (reference data) - continued lm4559xxx 0 25 50 75 100 125 150 -50-250 255075100 ambient temperature [c] input bias current [na] 0 1 2 3 4 5 6 -50-250 255075100 ambient temperature [c] slew rate h-l [v/s] figure 14. slew rate h-l vs ambient temperature (vcc/vee=15v, r l =2k , c l =100pf) -30 -20 -10 0 10 20 30 -50-25 0 25 50 75100 ambient temperature [c] input offset current [na] figure 17. input offset current vs ambient temperature (vcc/vee=15v) figure 16. input bias current vs ambient temperature (vcc/vee=15v) 0 20 40 60 80 100 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency [hz] gain[db] 0 40 80 120 160 200 phase [deg] phase gain figure 15. voltage gain ? phase vs frequency (vcc/vee=15v, r l =2k ) 10 3 10 4 10 5 10 6 10 7 10 8 (*)the data above is measurement value of typical sample, it is not guaranteed.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 11/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx typical performance curves (reference data) - continued lm4559xxx 0.0 0.2 0.4 0.6 0.8 1.0 0 5 10 15 20 supply voltage [v] input referred noise voltage [vrms] 0 10 20 30 40 50 60 frequency [hz] equivalent input noise voltage [nv/ hz] 0.0001 0.001 0.01 0.1 1 0.01 0.1 1 10 100 output voltage [vrms] total harmonic distortion [%] (*)the data above is measurement value of typical sample, it is not guaranteed. figure 19. equivalent input noise voltage vs frequency (vcc/vee=15v, t a =25c, a v =40db) figure 20. equivalent input noise voltage vs supply voltage (ta=25c, din audio) figure 18. total harmonic distortion vs output voltage (vcc/vee=15v, r l =2k ) 20hz 1khz 20khz 1 10 10 2 10 3 10 4 10 5
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 12/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx application information null method condition for test circuit 1 vcc, vee, e k , v icm unit:v parameter v f s1 s2 s3 vcc vee ek v icm calculation input offset voltage v f1 on on off 15 -15 0 0 1 large signal voltage gain v f2 on on on 15 -15 -10 0 2 v f3 10 common mode rejection ratio (input common-mode voltage range) v f4 on on off 15 -15 0 -10 3 v f5 10 power supply rejection ratio v f6 on on off 4 -4 0 0 4 v f7 18 -18 calculation 1. input offset voltage (v io ) 2. large signal voltage gain (a v ) 3. common mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) v io |v f1 | = 1+r f /r s [v] a v |v f2 -v f3 | = ? e k (1+r f /r s ) [db] 20log cmrr |v f4 - v f5 | = ? v icm (1+r f /r s ) [db] 20log psrr |v f6 - v f7 | = ? v cc (1+ r f /r s ) [db] 20log figure 21. test circuit 1 vcc r f =50k ? r i =10k ? 0.1f r s =50 ? r l sw3 500k ? 500k ? 0.1f e k 15v dut vee v rl 50k ? v icm sw1 0.1f r i =10k ? v o v f r s =50 ? 1000pf 0.1f -15v null
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 13/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off off maximum output voltage r l =2k ? off on off off on off off on off off on off slew rate off off on off off off on off on off off on unity gain frequency on off off on on off off off on off off on figure 24. test circuit 3 (channel separation) figure 23. slew rate input output wave figure 22. test circuit2 vcc vee r2=100k ? r1=1k ? vcc vee out1 =1vrms vin out2 cs=20log 100out1 r2=100k ? r1//r2 r1//r2 r1=1k ? out2 vh vl input wave t input voltage vh vl t v output wave sr= v/ t t output voltage 90% 10% sw3 sw1 sw2 sw9 sw10 sw11 sw8 sw5 sw6 sw7 c l sw12 sw4 r1 1k ? r2 100k ? r l vee vcc=30v v o v in- v in+
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 14/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx application example voltage follower inverting amplifier non-inverting amplifier figure 26. inverting amplifier circuit figure 27. non-inverting amplifier circuit for inverting amplifier, in is amplified by a voltage gain decided by the ratio of r1 and r2. the out-of-phase output voltage is shown in the next expression. out=-(r2/r1) ?in this circuit has input impedance equal to r1. for non-inverting amplifier, in is amplified by a voltage gain decided by the ratio of r1 and r2. out is in-phase with in and is shown in the next expression. out=(1+r2/r1) ?in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. figure 25. voltage follower voltage gain is 0db. using this circuit, the output voltage (out) is controlled to be equal to the input voltage (in). this circuit also stabilizes out due to high input impedance and low output impedance. computation for out is shown below. out=in r 2 r 1 vee r 1 // r2 in out vcc vee out in vcc vee r2 vcc in out r1
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 15/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically equal to the maximum storage temperature. the heat gener ated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 28 (a) shows the model of the thermal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax t a ) / p d c/w ????? ( ) the derating curve in figure 28 (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certai n temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumpti on, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the sa me of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 28 (c) shows an exam ple of the derating curve for lm4559xxx. (9) (10) (11) (12) unit 5.5 5.4 5.0 4.7 mw/c when using the unit above t a =25c, subtract the value above per c . permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (copper foil area below 3%) is mounted 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] (c) lm4559xxx figure 28. thermal resistance and derating curve (b) derating curve a mbient temperature t a [ c ] chip surface temperature t j [ c ] (a) thermal resistance ja =(t jmax -t a )/ p d c/w lm4559f (note 9) lm4559fj (note 10) lm4559fv (note 11) lm4559fvt (note 11) lm4559fvm (note 12) lm4559fvj (note 12) 85 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi p dmax ja2 < ja1 ? ja2 ja2 ? ja1 ja1 t a [ c ] t j?max t jmax power dissipation of ic
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 16/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properti es of the chip. the absolute maximum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epox y board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 17/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx operational notes ? continued 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 30. example of monolithic ic structure 12. unused circuits it is recommended to apply the connection (see figure 29.) and set the non-inverting input terminal at a potential within the input common-mode voltage range (v icm ) for any unused circuit. 13. input voltage applying vee +36v to the input terminal is possible without causing deterioration of the electrical charac teristics or destruction, regardless of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 14. power supply(single/dual) the voltage comparator operates if a certain level of voltage is applied between vcc and vee. therefore, t he operational amplifier can be operated under single power supply or split power supply. 15. ic handling when pressure is applied to the ic through warp on the print ed circuit board, the characte ristics may fluctuate due to the piezo effect. be careful with the warp on the printed circuit board. 16. the ic destruction caused by capacitive load the ic may be damaged when vcc terminal and vee terminal is shorted with the charged output terminal capacitor. when ic is used as an operational amplifier or as an applicati on circuit where oscillation is not activated by an output capacitor, output capacitor must be kept below 0.1 f in order to prevent the damage mentioned above. application circuit for unused op-amp figure 31. the example of vee vcc v icm keep this potential in vicm
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 18/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx physical dimensions tape and reel information package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr))
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 19/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx physical dimension tape and reel information - continued package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 20/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx physical dimension tape and reel information - continued package name ssop-b8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 21/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx physical dimension tape and reel information - continued package name tssop-b8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 22/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx physical dimension tape and reel information - continued package name msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 23/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx physical dimension tape and reel information - continued package name tssop-b8j direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () 1pin
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 24/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx marking diagram product name package type marking lm4559 f sop8 4559 fj sop-j8 l4559 fv ssop-b8 4559 fvt tssop-b8 l4559 fvm msop8 l4559 fvj tssop-b8j l4559 sop8(top view) part number marking lot number 1pin mark sop-j8(top view) part number marking lot number 1pin mark ssop-b8(top view) part number marking lot number 1pin mark tssop-b8(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark tssop-b8j(top view) part number marking lot number 1pin mark
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 25/25 04.dec.2013 rev.003 tsz22111 ? 15? 001 lm4559xxx land pattern data all dimensions in mm pkg land pitch e land space mie land length ? 2 land width b2 sop8 1.27 4.60 1.10 0.76 sop-j8 1.27 3.90 1.35 0.76 ssop-b8 0.65 4.60 1.20 0.35 tssop-b8 0.65 4. 60 1.20 0.35 msop8 0.65 2.62 0.99 0.35 tssop-b8j 0.65 3.20 1.15 0.35 revision history date revision changes 30.nov.2012 001 new release 28.aug.2013 002 added lm4559fv, lm4559f j,lm4559fvt,lm4559fvm,lm4559fvj 04.dec.2013 003 changed input bias current(max value) mie ? 2 b 2 e
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number lm4559f package sop8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes lm4559f - web page distribution inventory

▲Up To Search▲

Price & Availability of LM4559FJ-E2

	To Download LM4559FJ-E2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .